Technology Development Manager / Senior Manager

onsemi is seeking a highly motivated Technology Development Manager or Senior Manager to lead the development, qualification, and high-volume manufacturing ramp of Embedded Power Module technologies at our East Fishkill, NY 300mm wafer fab.

This role is a critical leadership position within the Technology Development organization, with end-to-end accountability for developing onsemi’s advanced Embedded Power Module process and packaging concepts into qualified, manufacturable, and competitive products aligned with onsemi’s long-term technology and business roadmaps.

The successful candidate will lead a team of experienced development engineers and will serve as a key technical and organizational interface across Business Units, Product Engineering, Manufacturing, Operations, Packaging, Reliability, Finance, external partners, and executive leadership.

• Responsibilities

People & Organization Leadership

• Manage and develop a team of approximately 5–15 engineers.

• Build a high-performance engineering culture and support talent development and succession planning.

Technical & Technology Ownership

• Serve as overall technical leader for Embedded Power Module technology development, qualification, and ramp.

• Own technical readiness across process integration, yield, reliability, and manufacturability.

Program Execution & Delivery

• Lead and deliver multiple concurrent technology development programs aligned with global corporate technology development and manufacturing requirements.

• Partner with program and product management to transition technologies into high-volume production.

Cross-Functional & Executive Engagement

• Act as primary interface with internal stakeholders and external partners.

• Communicate technical and program status to senior and executive leadership.

Qualifications

QUALIFICATIONS

• M.S. degree or higher in engineering (PhD preferred).

• Extensive semiconductor industry experience (typically 15+ years).

• Strong leadership, communication, and cross-functional collaboration skills.

Preferred

• Deep knowledge of power modules, ICs, advanced packaging, and backend processing.

• Experience with Cu plate-up, RDL via etch, encapsulation, pick-and-place, sinter attach, and HV testing is desired.

Salary: onsemi is excited to share the base salary range for this position is $147.000 to $250,000 exclusive of fringe benefits or potential bonuses. The final pay rate for the successful candidate will depend on geographic location, skills, education, experience, and/or consideration of the internal equity of our current team members. We also offer a competitive benefits package.

About Us

onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

More details about our company benefits can be found here:

About the Team

We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.

onsemi is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, ethnicity, color, religion, ancestry, national origin, age, marital status, pregnancy, sex, sexual orientation, physical or mental disability, medical condition, genetic information, military or veteran status, gender identity, gender expression, or any other protected category under applicable federal, state, or local laws.

If you are an individual with a disability and require a reasonable accommodation to complete any part of the application process, or are limited in the ability or unable to access or use this online application process and need an alternative method for applying, you may contact [email protected] for assistance.